ATX Shanghai

Characterization Services

Thermal

Thermal Characterization
As operating frequency is getting higher and transistors getting smaller, the power densities of devices become higher and higher. The needs for small form factor and functional integration (MCM/SiP) make thermal management more challenging. ATXSH can provide simulation and measurement services that help our customers to overcome thermal issues. These services include:

In pre-design phase:

Package thermal resistance simulation

Heat sink effect evaluations

Preliminary thermal studies for advanced packages

In design phase:

Hot spots impact evaluations

Customized heat sink effects

In post-design phase:

Thermal measurements

Thermal measurements include the measurements for package thermal parameters:

JA (Junction-to-ambient thermal resistance)

JC (Junction-to-case thermal resistance)

JB (Junction-to-board thermal resistance)

JT (Junction-to-top thermal characterization parameter)

JB (Junction-to-board thermal characterization parameter)

Electrical

Electrical Characterization
ATXSH Electrical team is dedicated to provide IC package electrical characteristics design and analysis in terms of simulation and measurement. We also work closely with customers to provide custom IC packaging solutions. The characterization services include:

R.L.C for critical Traces

R.L.C for Min/Max Traces

IBIS Model

SPICE Model

Power Noise Analysis

Ground Noise Analysis

Impedance Analysis

Cross Talk Noise Analysis

Noise Isolation Analysis

Signal Integrity Analysis

S-parameters Analysis

Customized Design Service

Stress & Reliability

Reliability Characterization
The reliability characterization is used to analyze the package reliability by measurement. The analysis also consists of root cause investigation into packaging failure (like die crack, delamination) and optimal design for low stress and high reliability. The characterization services include:

Board Level Reliability Test and Simulation
Temperature cyclic test
Drop test(under set up)
Failure analysis

FA

Failure Analysis

Encapsulant: Incomplete fill / Wire sweep / Warpage / Delamination / Void

Silver epoxy: Outgassing / Delamination / Void / Bleed

Substrates: Warpage / Contamination / Crack

Flux: Flux residue / Outgassing / Corrosion

Lead frame: Contamination / Moisture uptake

Under fill: Delamination / Void